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datashee t 1/11 tsz02201-0rcr1gz00070-1-2 ? 2012 rohm co., ltd. all rights reserved. 2012.10.29 rev.002 www.rohm.co.jp tsz22111 ? 14 ? 001 zct:zero current transformer trip coil test sw&r c od scr r vs c vs vz c os c1 c vr c in r in in vr od gnd vs os nr sc 8 7 6 5 1 2 3 4 latch block reference voltage output block earth leakage current detector automotive earth leakage current detector ic bd9582f-m general description bd9582f-m integrates leakage detector and amplifier. especially, it is suitable for high sensitivity and a high- speed operation use, and sinc e the operating temperature range is wide, it can be used for various uses. features small temperature fluctuation and high input sensitivity wide operating temperature range applications earth leakage circuit breaker earth leakage circuit relay key specifications operating supply voltage range 12v to 22v operating temperature range 40c to 105c supply current 330 a(typ.) trip voltage 4.48mv to 11.06mv output current ability(ta= 40 ) 200 a (min.) packages w(typ.) x d(typ.) x h(max.) sop8 5.00mm x 6.20mm x 1.71mm typical application circuit example product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays.
datasheet d a t a s h e e t 2/11 bd9582f-m tsz02201-0rcr1gz00070-1-2 ? 2012 rohm co., ltd. all rights reserved. 2012.10.29 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 sop8 (top view) 1 2 3 4 8 7 6 5 in vr od gnd vs os nr sc 8 7 6 5 1 2 3 4 latch block reference voltage output block pin configurations block diagrams pin descriptions pin no. symbol function 1 vr reference voltage 2 in input 3 gnd ground 4 od output of input comparator 5 sc input of latch circuit 6 nr noise absorption 7 os output 8 vs power supply absolute maximum ratings (ta=25 ) parameter symbol rating unit supply current *1 is 8 ma in-vr current i in-vr 250 ma vr pin current i vr 30 ma in terminal current i in 30 ma sc terminal current i sc 5 ma power supply voltage vs 36 v input terminal voltage v vr/in 17 v od/sc/nr/os terminal voltage v od/sc/nr/os 8 v power dissipation pd 680 *2 mw storage temperature t stg 55 to 150 *1 the power-supply voltage is limited by the internal clamping circuit. *2 to use at temperature above ta 25 reduce 5.5mw/ . mounted on a glass epoxy pcb (70mm70mm1.6mm)
datasheet d a t a s h e e t 3/11 bd9582f-m tsz02201-0rcr1gz00070-1-2 ? 2012 rohm co., ltd. all rights reserved. 2012.10.29 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 recommended operating ratings parameter symbol limits unit supply voltage vs 12 to 22 v operating temperature t opr 40 to 105 external capacitor between vs and gnd c vs 1 Q f external capacitor between os and gnd c os Q 1 f electrical characteristics ( unless otherwise specified, vs=12v, gnd=0v, ta=25 ) parameter symbol temperature range limits unit conditions min. typ. max. supply current is1 -40 - - 520 a vin=v vr -v in =30mv 25 - 330 500 105 - - 460 trip voltage v t -40 to +105 4.48 7.50 11.06 mv v t = vin=v vr -v in od source current i odso 25 -27.2 -20.6 -14.0 a vin=v vr -v in =30mv, v od =1.2v od sink current i odsi 25 16.7 26.0 35.3 a v od =0.8v, vin=v vr -v in =0mv os source current i osso -40 -200 - - a v sc =2.0v, v os =0.8v 25 -100 - - 105 -75 - - os sink current i ossi -40 to +105 200 - - a v sc =0.2v, v os =0.2v sc on voltage v scon 25 1.00 1.24 1.48 v input clamp voltage v ic -40 to +105 4.2 5.5 6.8 v i ic =20ma differential input clamp voltage v idc -40 to +105 0.5 1.0 1.5 v i idc =100ma maximum current voltage v sm 25 26 29 32 v is=7ma supply current 2 1 i os2 -40 to +105 -100 - - a is=900 a,v sc =2.0v v os =0.8v latch off supply voltage v soff 25 2.7 3.7 4.7 v operating time 2 t on 25 1.8 2.9 4.0 ms *1 supply current 2 is os source curren t value when the power supply current(is=900 a) is given. *2 operating time is time until output voltage reaches 0.8v after detecting the leakage signal. conditions : capacitor(0.047 f) is connected between od(os) and gnd.
datasheet d a t a s h e e t 4/11 bd9582f-m tsz02201-0rcr1gz00070-1-2 ? 2012 rohm co., ltd. all rights reserved. 2012.10.29 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 1 2 3 4 5 6 7 8 vr in od sc nr os vs gnd 1 2 3 4 5 6 7 8 vr in od sc nr os vs gnd 1 2 3 4 5 6 7 8 vr in od sc nr os vs gnd 1.is1 is a vs vs 2.v t 3.i odso vin vin vin vs iod a vod 1 2 3 4 5 6 7 8 vr in od sc nr os vs gnd 1 2 3 4 5 6 7 8 vr in od sc nr os vs gnd 1 2 3 4 5 6 7 8 vr in od sc nr os vs gnd 4.i odsi 5.i osso /i ossi 6.v scon 1 2 3 4 5 6 7 8 vr in od sc nr os vs gnd 1 2 3 4 5 6 7 8 vr in od sc nr os vs gnd 1 2 3 4 5 6 7 8 vr in od sc nr os vs gnd 7.v ic 8.v idc 9.v sm 1 2 3 4 5 6 7 8 vr in od sc nr os vs gnd 1 2 3 4 5 6 7 8 vr in od sc nr os vs gnd 10.i os2 0.047 f 11.v soff 12.t on vin vs iod a vod vsc ios a vos vsc vos v vs ic vs iidc v vsm is v v os vs 0.047 f v 0.047 f vic v vidc v 1 2 3 4 5 6 7 8 vr in od sc nr os vs gnd vsc ios a vos vs is vod v + + + + + v t v scon t on 0.8v test circuits timing chart input voltage between in and vr vin (in-vr) od/sc terminal voltage v od /v sc os terminal voltage v os
datasheet d a t a s h e e t 5/11 bd9582f-m tsz02201-0rcr1gz00070-1-2 ? 2012 rohm co., ltd. all rights reserved. 2012.10.29 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 0 100 200 300 400 500 600 700 800 0 5 10 15 20 25 30 power supply vs [v] supply c urrent is [ua] -40 -30 -20 -10 0 10 20 30 40 -60 -40 -20 0 20 40 60 80 100 120 ambient temperature ta [ ] rate of fluctuation [% ] -500 -400 -300 -200 -100 0 0 5 10 15 20 25 power supply vs [v] os terminal source current i osso [ua] 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0 255075100125150 ambient temperature ta [ ] power dissipation [w] 105 typical performance curves(reference data) figure 3 trip voltage fluctuation rate - ambient temperature figure 4 os terminal source current - supply voltage 25 105 60 figure 1 derating curve figure 2 circuit current - supply voltage rin=1k ? rin=300 25 105 60
datasheet d a t a s h e e t 6/11 bd9582f-m tsz02201-0rcr1gz00070-1-2 ? 2012 rohm co., ltd. all rights reserved. 2012.10.29 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 0 1 2 3 4 5 -60 -40 -20 0 20 40 60 80 100 120 ambient temperature ta [ ] o p eratin g tim e t on [ ms ] 0 2 4 6 8 10 012345678910 power supply vs [v] os terminal volta g e v os [v] 0 2 4 6 8 10 012345678910 power supply vs [v] o s term inal volta g e v os [v ] 0 2 4 6 8 10 0.6 0.8 1.0 1.2 1.4 1.6 1.8 sc terminal input voltage v scon [v] os terminal voltage v os [v] figure 5 operating time - ambient temperature figure 6 latch off supply voltage - ambient temperature figure 7 sc on voltage - ambient temperature figure 8 latch on supply voltage - ambient temperature 25 105 60 25 105 60 25 105 60
datasheet d a t a s h e e t 7/11 bd9582f-m tsz02201-0rcr1gz00070-1-2 ? 2012 rohm co., ltd. all rights reserved. 2012.10.29 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0 25 50 75 100 125 150 ambient temperature ta [ ] power dissipation [w] 105 power dissipation power dissipation(total loss) indicates the po wer that can be consumed by ic at ta=25 (normal temperature).ic is heated when it consumed power, and the temperature of ic chip bec omes higher than ambient temper ature. the temperature that can be accepted by ic chip depends on circuit configurati on, manufacturing process, and co nsumable power is limited. power dissipation is determined by the temperature allowed in ic chip (maximum junction temperature) and thermal resistance of package (heat dissipation capability). the maximum junction temperature is typically equal to the maximum value in the storage temperatur e range. heat generated by cons umed power of ic radiates from the mold resin or lead frame of the package. the parameter which indicates this heat dissipation capability(hardness of heat release)is called thermal resistance, represented by the symbol ja /w.the temperature of ic inside the package can be estimated by this thermal resistance. fig.9(a) shows the model of thermal resistance of the package. thermal resistance ja, ambient temperature ta, junction temperature tj, and power di ssipation pd can be calculated by the equation below ja = (tj - ta) / pd /w ????? ( ) derating curve in fig.9(b) indicates power that can be consum ed by ic with reference to ambient temperature. power that can be consumed by ic begins to attenuate at certain ambi ent temperature. this gradient is determined by thermal resistance ja. thermal resistance ja depends on chip size, power consumptio n, package, ambient te mperature, package condition, wind velocity, etc even when the same of package is used. thermal reduction curve indicates a reference value measured at a specified conditi on. fig.10(a) show a derating curve for an example of bd9582f-m. derating curve slope unit bd9582f-m 5.5 mw/ when using the unit above ta=25 , subtract the value above per degree permissible dissipation is a value wh en fr4 glass epoxy board 70mm70mm1.6mm (cooper foil area below 3%) is mounted. (a) thermal resistance (b) derating curve figure 9. thermal resistance and derating (a) bd9582f-m ja=(tj-ta)/p /w figure 10. derating curve ?? ta [ ] ? ? tj [ ] M p [w] ambient temperature chip surface temperature power dissipation pd[w] 0 50 75 100 125 150 25 p1 p2 pd (max) lsi M [w] ' ja2 ' ja1 tj ' (m ax ) ja2 < ja1 ?? ta [ ] ja2 ja1 tj (m ax ) ambient temperature power dissipation of lsi
datasheet d a t a s h e e t 8/11 bd9582f-m tsz02201-0rcr1gz00070-1-2 ? 2012 rohm co., ltd. all rights reserved. 2012.10.29 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 vcc line (internal power supply line) vcc vcc pin 1 [vr] pin 5 [sc] pin 2 [in] pin 6 [nr] pin 3 [gnd] pin 7 [os] pin 4 [od] pin 8 [vs] vcc vcc vcc vcc vcc pin 7 vs vcc pin 1 pin 6 vs vcc pin 2 100ko 300o 100ko 300o esd pro tect i/o equivalence circuit
datasheet d a t a s h e e t 9/11 bd9582f-m tsz02201-0rcr1gz00070-1-2 ? 2012 rohm co., ltd. all rights reserved. 2012.10.29 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 operational notes 1) absolute maximum ratings absolute maximum ratings are the values which indicate t he limits, within which the given voltage range can be safely charged to the terminal. however, it does not guarantee the circuit operation. 2) power dissipation pd using the unit in excess of the rated power dissipation may caus e deterioration in electrical characteristics due to a rise in chip temperature, including reduced current capability. theref ore, please take into consideration the power dissipation (pd) under actual operating conditions and apply a sufficient margin in thermal design. refer to the thermal derating curves for more information. 3) terminal short-circuits when the output and power supply terminals are shorted, excessive output current may flow, resulting in undue heat generation and, subsequently, destruction. 4) ground terminal voltage all time, ground terminal voltage should keep lowest voltage. in addition, please confirm whether there is not really a te rminal becoming the voltage that is lower than gnd including a transitional phenomenon. 5) operation in a str ong electromagnetic field operation in a strong electromagnet ic field may cause malfunctions. 6) short-circuit between pins and erroneous mounting incorrect mounting may damage the ic. in addition, the presenc e of foreign particles betwe en the outputs, the output and the power supply, or the output and gnd may result in ic destruction. 7) ic handing applying mechanical stress to the ic by deflecting or bending the board may cause fluct uations in the electrical characteristics due to piezo resistance effects. 8) board inspection connecting a capacitor to a pin with low impedance may stre ss the ic. therefore, discharging the capacitor after every process is recommended. in addition, when attaching and detac hing the jig during the inspec tion phase, ensure that the power is turned off before inspection and removal. furthe rmore, please take measures against esd in the assembly process as well as during transportation and storage. status of this document the japanese version of this document is fo rmal specification. a customer may use this translation version only for a reference to help reading the formal version. if there are any differences in translation version of this document formal version takes priority.
datasheet d a t a s h e e t 10/11 bd9582f-m tsz02201-0rcr1gz00070-1-2 ? 2012 rohm co., ltd. all rights reserved. 2012.10.29 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin (unit : mm) sop8 0.9 0.15 0.3min 4 + 6 ? 4 0.17 +0.1 - 0.05 0.595 6 4 3 8 2 5 1 7 5.0 0.2 6.2 0.3 4.4 0.2 (max 5.35 include burr) 1.27 0.11 0.42 0.1 1.5 0.1 s 0.1 s ordering information b d 9 5 8 2 f - m e 2 part numbe r package f: sop8 packaging and forming specification e2: embossed tape and reel (sop8) physical dimension tape and reel information marking diagrams sop8 (top view) 9582m lot number pin mark
datasheet d a t a s h e e t 11/11 bd9582f-m tsz02201-0rcr1gz00070-1-2 ? 2012 rohm co., ltd. all rights reserved. 2012.10.29 rev.002 www.rohm.co.jp tsz22111 ? 15 ? 001 revision history date revision changes 2012.10.29 001 new release
datasheet d a t a s h e e t notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. notice general precaution 1) before you use our products, you are requested to care fully read this document and fully understand its contents. rohm shall not be in any way responsible or liable for fa ilure, malfunction or accident arising from the use of any rohm?s products against warning, caution or note contained in this document. 2) all information contained in this document is current as of the issuing date and subjec t to change without any prior notice. before purchasing or using rohm?s products, please confirm the la test information with a rohm sales representative. precaution on using rohm products 1) our products are designed and manufactured for applicat ion in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremel y high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. 2) rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4) the products are not subjec t to radiation-proof design. 5) please verify and confirm characteristics of the final or mounted products in using the products. 6) in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse) is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7) de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8) confirm that operation temperature is within t he specified range described in the product specification. 9) rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document.
datasheet d a t a s h e e t notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. precaution for mounting / circuit board design 1) when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2) in principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification precautions regarding application examples and external circuits 1) if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2) you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1) product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2) even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3) store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1) all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2) no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document.
datasheet d a t a s h e e t notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. other precaution 1) the information contained in this document is provi ded on an ?as is? basis and rohm does not warrant that all information contained in this document is accurate and/or error-free. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 3) the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 4) in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 5) the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.

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